Thermal Conductive Pads

Product Details:

thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper). Thermal pads and thermal compound are used to fill air gaps caused by imperfectly flat or smooth surfaces which should be in thermal ,they would not be needed between perfectly flat and smooth surfaces. Thermal pads are relatively firm at room temperature, but become soft and are able to fill gaps at higher temperatures.

Product Details:

Thermally Conductive Silicone Interface PaD is a very conformable and soft pad with thermal conductivity of 1.5 W/m-K - 4.0 W/m,k . These pad are featuring a supporting layer for easy handling and assembly. This pad consists of a slightly tacky silicone elastomeric sheet filled with thermally conductive ceramic particles. It is designed to transfer heat from heat generating components to heat sinks and cooling devices, improving device reliability and extending the component's life.
Our Thermally Conductive Silicone Interface has a soft pad that conforms to uneven substrates, providing excellent wettability to fill gaps for improved thermal performance. The "S" supporting layer (permanent film carrier) has a non-tacky surface, providing excellent workability, puncture resistance, and the flexibility to rework materials. The thin, firm low-tack layer provides easy handling for pre-assembly and die-cutting. The thin, firm, low-tack layer provides easy handling for pre-assembly and die-cutting. This pad provides robust thermal management for applications in a variety of market segments, such as consumer electronics, automotive, LED lighting, medical devices, communication infrastructure, and aerospace & defense.
Recommended Applications:
Heat transfer between PCB and heat sink
Integrated chip (IC) packaging heat conduction
Chip on film (COF) heat dissipation
Gap filling in electronic devices
Decrease of compression stress to electronic parts by thermal pad softness
Examples:
LED displays
Electric vehicle (EV) batteries
Wireless charging units
Satellite navigation
Sensors
Process control equipment
Test & measurement devices
Our family of  Thermally Conductive Silicone Interface Pads performs well in applications requiring high temperatures. The soft silicone pads conform to a variety of substrates. These pads come in a variety of thicknesses to meet your design needs.

Product Details:

Thermal Pads
Tapeindia’s Thermal   Pads provide effective thermal interfaces between heat sinks and electronic devices, accommodating for uneven surfaces, air gaps, and rough surface textures. The thermally conductive pad's soft construction offers high conformability to reduce interface resistance. In addition to effective heat dissipation, these thermal pads also help reduce vibration stress for shock dampening.
Exceptionally simple to use, Tapeindia’s Thermal Pads are manufactured to size and facilitate easy application: operators simply peel the protective film and place the thermal management pad on the desired component.
Our thermal pads are produced in a variety of standard dimensions and thicknesses but can also be customized for specific application requirements. Available as custom die-cut parts with the ability to individualize thickness and constructions, Tapeindia’s Thermal Pads are always fit for purpose to ensure optimized thermal control no matter what the application.
With shock dampening abilities, these pads are recommended for applications that require a minimum amount of pressure between components. For applications that do not allow silicone, such as silicone-sensitive optic components and automotive lighting, Tapeindia’s Thermal Pads are available in a silicone-free formulation
 
The broad product family provides an effective thermal interface where textures are present, and the thermal conductivity range is extensive—going as high as 12.0 W/mK. Our application specialists work closely with customers to specify the proper material for each unique requirement.
Features
Each product within the Tapeindia portfolio is unique in construction, properties, and performance. Features include:
Low-modulus polymer material
Available with fiberglass/rubber carriers or in a non-reinforced version
Innovative filler technology to achieve specific thermal and conformability characteristics
Highly conformable to uneven and rough surfaces with very low-stress compression
Electrically isolating
Natural tack on one or both sides with protective liners
Variety of thicknesses and hardnesses
Wide range of thermal conductivities
Available in sheets and die-cut parts
BenefitsTapeindia’s Thermal Pads are designed to improve an assembly’s thermal performance and reliability:
Eliminate air gaps to reduce thermal resistance
Ultra-conformable with minimal compression; low modulus reduces interfacial resistance
Low-stress vibration dampening and shock absorbing
Easy material handling and simplified application
Puncture, shear, and tear resistance
Improved performance for high-heat assemblies
Tapeindia’s Thermal Pads are well-suited to a wide variety of electronics, automotive, medical, aerospace, and satellite applications, such as:
Between an IC and a heat sink or chassis (BGAs, QFPs, SMT power components)
Between a semiconductor and heat sinkMemory modules and heat pipe assemblies
DDR SDRAM and Hard drive coolingPower supplies and 
IGBT modules 
Signal amplifiers

Additional Information:

• Item Code: TITP5
• Production Capacity: 10000